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ISD8101 ISD8101 datasheet rev. 1.8 - 1 - nov, 2012 ISD8101 1.5w audio amplifier with chip enable
ISD8101 ISD8101 datasheet rev. 1.8 - 2 - nov, 2012 1 general description the isd8100 is a general purpose analog audio ampli fier capable of driving an 8-ohm load with up to 1.5wrms output power. this device includes current limiting and a chip enable pin with low standby current and excellent pop-and-click performance. also included is the ability for the inputs to be c onfigured as either single-ended or differential. internal resistors set the device gain at 20db in the single ended output configuration. with external resistor s, any gain less than 20db can be achieved. the devic e is unity gain stable, including when used with external input resistors and external capacitors as may be optionally used for implementing simple filtering functions. 2 features ? wide power supply range and excellent standby current o 2.4vdc - 6.8vdc operation o <1ua standby current ? high output power (capless btl configuration) o up to 1.5-w output into 8-ohm load (<10% distortion) with 6.8vdc supply voltage o < 0.1% distortion at 500mw into 8-ohms with 5vdc supply voltage ? excellent pop-and-click performance o low to inaudible pop/click using chip enable ? single-ended or differential signal inputs o > 40db common mode rejection in differential mode o > 40db power supply noise rejection ? very fast start-up time o less than 1msec when using chip enable applications: ? toys ? mobile phones ? current limiting for over-current conditions ? greeting cards ? package options: pb-free sop-8, sop-8 (ex-pad), pdip-8 ? portable speakers ? boom box ? temperature range: -40c to +85c ? white goods
ISD8101 ISD8101 datasheet rev. 1.8 - 3 - nov, 2012 3 block diagram figure 3-1 ISD8101 block diagram
ISD8101 ISD8101 datasheet rev. 1.8 - 4 - nov, 2012 4 pinout configuration: 4.1 sop- 8 spn spp gnd inp inv vref ce vdd ISD8101 sop-8 s-suffix optional thermal ex-pad 2 1 3 4 5 6 7 8 figure 4-1 ISD8101 8-lead sop pin configuration. 4.2 pdip-8 figure 4-2 ISD8101 8-lead pdip pin configuration.
ISD8101 ISD8101 datasheet rev. 1.8 - 5 - nov, 2012 5 pin description pin number pin name i/o function 1 spn o non-inverting speaker output 2 spp o inverting speaker output 3 gnd i ground 4 inp i non-inverting signal input 5 inv i inverting signal input 6 vref o internal reference voltage (1/2 vdd) 7 ce i chip enable 8 vdd i supply voltage 9 ex-pad i thermal tab (must be connected to vss, s op-8 package, only)
ISD8101 ISD8101 datasheet rev. 1.8 - 6 - nov, 2012 6 electrical characteristics 6.1 o perating c onditions operating conditions (die) conditions values operating temperature range 1 0c to +50c supply voltage (v dd ) +2.4v to +6.8v ground voltage (v ss ) 0v input voltage (v dd ) vss to v dd voltage applied to any pins (v ss ?0.3v) to (v dd +0.3v) operating conditions (industrial packaged parts) conditions values operating temperature range (case temperature) 1 -40c to +85c supply voltage (v dd ) +2.4v to +6.8v ground voltage (v ss ) 0v input voltage (v dd ) vss to v dd voltage applied to any pins (v ss ?0.3v) to (v dd +0.3v) notes: [1] conditions v dd =3.3v, t a =25c unless otherwise stated. die temperature mus t at all times be kept less than 125c by appropriate therma l design of the system. 6.2 dc p arameters parameter symbol min typ [1] max units conditions supply voltage v dd 2.4 6.8 v operating current i dd 2.4 ma v dd = 5v, no load standby current i sb 0.1 1 a v dd = 5v ce input resistance 20k internal pull-down ce input current 120 a ce = 2.3v, v dd = 5v ce threshold enabled v enl 0.9 v all supply voltages ce threshold standby v enh 1.5 v all supply voltages vref reference voltage v dd /2 v notes: [1] conditions v dd = 3.3v, t a = 25c unless otherwise stated. die temperature mu st at all times be kept less than 125c by appropriate th ermal design of the system.
ISD8101 ISD8101 datasheet rev. 1.8 - 7 - nov, 2012 6.3 ac p arameters 6.3.1 analog characteristics; cref=4.7uf parameter symbol min typ max units conditions audio input voltage range 0.3 - 5.5 v vdd = 6.8vdc 0.3 - 2.3 v vdd = 3.3vdc 0.5 - 1.4 v vdd = 2.4vdc inverting input impedance 5k gain=20db non-inverting input impedance 60k gain=20db power supply rejection ratio psrr 41 db vdd = 5vd c common mode rejection ratio cmrr 40 db signal at inp = inv voltage gain 20 db rinput = zero-ohms enable time from standby 0.5 msec single-ended enable time from standby 0.5 msec differential pop-and-click from standby 1 10 mv single ended pop-and-click from standby 1 10 mv differential thermal resistance 2 90 c/w sop-8 (with ex-pad) thermal resistance 2 150 c/w sop-8 thermal resistance 2 117 c/w pdip-8 notes: [1] impulse voltage that is potentially audible. afte r impulse, there is a slow ramp from standby vref to operating vref, which is typically inaudibl e with cref = 4.7uf [2] thermal resistance values are calculated from a gen eric simulation following jedec specification (jesd51) and can vary depending upon pcb design.
ISD8101 ISD8101 datasheet rev. 1.8 - 8 - nov, 2012 6.3.2 speaker outputs parameter symbol min typ [1] max units conditions signal-to-noise ratio snr 100 db 0db gain, 5vdc output power (btl mode) load 8 vdd=5vdc 0db gain distortion = thd+n 500 mw <0.1% distortion 825 mw <1% distortion 1000 mw 5.6% distortion 1.1 watt <10% distortion 1.5 watt <10% distortion and vdd = 6.8vdc load impedance r l(spk) 7.5 8 output offset voltage 8 mv notes: [1] conditions v dd =3.3v, t a =25c unless otherwise stated. die temperature mus t at all times be kept less than 125c by appropriate therma l design of the system.
ISD8101 ISD8101 datasheet rev. 1.8 - 9 - nov, 2012 6.3.3 total harmonic distortion plus noise vs. outp ut power at 6.8vdc and 5.0vdc supply voltage with 8 & load conditions: thd+n measurement bandwidth 22hz to 22k hz at t a =25c thd+n @ vd d = 6.8vd c thd+n @ vd d = 6.8vd c thd+n @ vd d = 6.8vd c thd+n @ vd d = 6.8vd c -80 -70 -60 -50 -40 -30 -20 -10 0 0 0.5 1 1.5 2 2.5 output power (w) thd+n (db) thd+n @ vdd = 5.0vdc -80 -80-80 -80 -70 -70-70 -70 -60 -60-60 -60 -50 -50-50 -50 -40 -40-40 -40 -30 -30-30 -30 -20 -20-20 -20 -10 -10-10 -10 0 00 0 0 00 0 0.1 0.10.1 0.1 0.2 0.20.2 0.2 0.3 0.30.3 0.3 0.4 0.40.4 0.4 0.5 0.50.5 0.5 0.6 0.60.6 0.6 0.7 0.70.7 0.7 0.8 0.80.8 0.8 0.9 0.90.9 0.9 1 11 1 1.1 1.11.1 1.1 1.2 1.21.2 1.2 1.3 1.31.3 1.3 1.4 1.41.4 1.4 1.5 1.51.5 1.5 output power (w) thd+n (db)
ISD8101 ISD8101 datasheet rev. 1.8 - 10 - nov, 2012 6.3.4 total harmonic distortion plus noise vs. outp ut power at 3.3vdc and 2.4vdc supply voltage with 8 & load conditions: thd+n measurement bandwidth 22hz to 22k hz at t a =25c thd+n @ vd d = 3.3vd c thd+n @ vd d = 3.3vd c thd+n @ vd d = 3.3vd c thd+n @ vd d = 3.3vd c -80 -80-80 -80 -70 -70-70 -70 -60 -60-60 -60 -50 -50-50 -50 -40 -40-40 -40 -30 -30-30 -30 -20 -20-20 -20 -10 -10-10 -10 0 00 0 0 00 0 0.05 0.05 0.05 0.05 0.1 0.10.1 0.1 0.15 0.15 0.15 0.15 0.2 0.20.2 0.2 0.25 0.25 0.25 0.25 0.3 0.30.3 0.3 0.35 0.35 0.35 0.35 0.4 0.40.4 0.4 0.45 0.45 0.45 0.45 ou tp u t p o w e r (w) ou tp u t p o w e r (w) ou tp u t p o w e r (w) ou tp u t p o w e r (w) thd+n (db) thd+n @ vd d = 2.4vd c thd+n @ vd d = 2.4vd c thd+n @ vd d = 2.4vd c thd+n @ vd d = 2.4vd c -80 -70 -60 -50 -40 -30 -20 -10 0 0 0.05 0.1 0.15 0.2 0.25 ou tp u t po w e r (w) ou tp u t po w e r (w) ou tp u t po w e r (w) ou tp u t po w e r (w) thd+n (db)
ISD8101 ISD8101 datasheet rev. 1.8 - 11 - nov, 2012 6.3.5 typical peak output power note: peak output power becomes reduced as device becomes heated. sustained medium duration heating typical for audio limits maximum u seable output to approximately 1.5wrms at less than 10% distortion. 6.3.6 chip enable threshold voltage conditions: t a =25c peak output vs. supply voltage @ thd = 1% 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 0 1 2 3 4 5 6 7 8 vdc supply voltage peak output power (watts) chip enable threshold vs. supply voltage 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 0 1 2 3 4 5 6 7 8 vdc supply voltage (v) threshold voltage (v)
ISD8101 ISD8101 datasheet rev. 1.8 - 12 - nov, 2012 6.3.7 output noise spectrum noise spectrum at vdd = 5.0vdc, gain = 0db, bw<22k hz noise spectrum at vdd = 5.0vdc, gain = 20db, bw<22 khz
ISD8101 ISD8101 datasheet rev. 1.8 - 13 - nov, 2012 7 application diagrams 7.1 s imple gain setting spn 5 vref cref r l ISD8101 ce inp spp vdd gnd rg cin vin +5vdc 100uf 0.1 f device=enabled if ce left as no-connect inv 46 7 3 2 1 8 g r k k x spn spp gain output al differenti + = ? 5 50 2 ) ( by default: rg = 0 , ISD8101 differential output gain = 20 ISD8101 differential output gain (in db) = 20 x lo g (20) = 26db example: rg = 45k ISD8101 differential output gain = 2 ISD8101 differential output gain (in db) = 20 x lo g (2) = 6db device=power down, if ce left as no-connect
ISD8101 ISD8101 datasheet rev. 1.8 - 14 - nov, 2012 7.2 s ingle -e nded a nalog i nput the following application example is for reference. it is only to give a general idea of how to use th e ISD8101. each end-product design must be optimized in its own system for the best performance in terms of voice quality, power consumption, function ality, and other issues. spn inv 5 vref cref r l ISD8101 r1 5k r4 r6 r3 r5 r2 5k - + - + - + bias generator ce 4 inp spp vdd gnd 6 7 8 1 23 rg cin vin +5vdc cbulk 0.1 f 55k 55k device=enabled if ce left as no-connect figure 8-1 ISD8101 application diagram design suggestions 1.) choose the desired gain or amplification facto r: g = r3/(r1+rg) and then calculate the value fo r rg = r3/g - r1 and use r1=5.5k-ohm and r3=55k-ohm. 2.) choose the desired high pass frequency: fc = 1/(6.28*rin*cin) and then calculate the value for cin = 1/(6.28*rin*fc) and use rin=rg+r1 and fc = hi gh-pass frequency in hz. cin value is farads. it is best to choose cin as small as possible. thi s will minimize cost and any pop/click sound. 3.) choose the value for cref. note that cref doe s not generate any pop/click timing and that the main use for cref is to filter any supply voltage n oise. so, if the power supply noise is not a big concern, then cref can be small. typical values fo r cref can be between 0.1uf and 10uf, and a recommended value for general applications is from 1uf to 4.7uf. in general, it is best if cref is at least 3x larger in value than cin. this can help m inimize the first-time power-on pop noise. after t he first-time power-on, the cref value has no effect o n pop/click performance. 4.) choose the value for cbulk. this value will d epend on the both the physical layout (size and length of pcb traces/wires) and the power supply pr operties. the suggested value for cbulk is 100uf and is recommending to put close to the devi ce . if the power supply is far away or weak, then cbulk may need to be a larger value. if the power supply is very close and has high current capacity, then it may be possible to use a smaller value for cbulk. if cbulk is too small, the system can be unstable and may oscillate. device=power down, if ce left as no-connect
ISD8101 ISD8101 datasheet rev. 1.8 - 15 - nov, 2012 7.3 d ifferential i nput for a nalog or pwm the following application example is for reference, and is only to give a general idea how to use the ISD8101. each end-product design must be optimized in its own system for the best performance on voice quality, power consumption, functionality, an d all other issues. figure 8-2 ISD8101 application diagram design suggestions 1.) choose the desired gain or amplification facto r: g = r3/(r1+rg) and then calculate the value fo r rg = r3/g - r1 and use r1=5.5k-ohm and r3=55k-ohm. both rg parts should be the same value. 2.) choose the desired low-pass frequency: fc = 1 /(6.28*req*ceq) where ceq = 2*cf and req = r1 || rg to calculate the value of cf. for a pwm circ uit, fc should be about one-half the audio sample rate. 3.) choose the desired high pass-frequency: fc = 1/(6.28*rin*cin) and then calculate the value for cin = 1/(6.28*rin*fc) and use rin=rg+r1 and fc = hi gh-pass frequency in hz. cin value is farads. it is best to choose cin as small as possible and b oth cin parts should be the same value. this will minimize cost and any pop/click sound. 4.) choose the value for cref. note that cref doe s not generate any pop/click timing and that the main use for cref is to filter any supply voltage n oise. so, if the power supply noise is not a big concern, then cref can be small. typical values fo r cref can be between 0.1uf and 10uf, and a recommended value for general applications is from 1uf to 4.7uf. in general, it is best if cref is at least 3x larger in value than cin. this can help m inimize the first-time power-on pop noise. after t he first-time power-on, the cref value has no effect o n pop/click performance. 5.) choose the value for cbulk. this value will d epend on the both the physical layout (size and length of pcb traces/wires) and the power supply pr operties. the suggested value for cbulk is 100uf and is recommending to put close to the devi ce . if the power supply is far away or weak, then cbulk may need to be a larger value. if the p ower supply is close and has high current capacity, then it may be possible to use a smaller value for cbulk. if cbulk is too small, the system can be unstable and may oscillate.
ISD8101 ISD8101 datasheet rev. 1.8 - 16 - nov, 2012 package specification 7.4 8 l ead sop- 8 ( without thermal ex-pad) detail a l e h e y 0 . 0 1 0 l y c b a a1 d e h e e detail a
ISD8101 ISD8101 datasheet rev. 1.8 - 17 - nov, 2012 7.5 8 l ead sop- 8 ( with thermal ex-pad)
ISD8101 ISD8101 datasheet rev. 1.8 - 18 - nov, 2012 7.6 pdip-8 1.63 1.47 0.064 0.058 symbol min nom max max nom min dimension in inch dimension in mm ab c d e a ls aa 12 e 0.060 1.52 0.175 4.45 0.010 0.125 0.016 0.130 0.018 0.135 0.022 3.18 0.41 0.25 3.30 0.46 3.43 0.56 0.008 0.120 0.375 0.010 0.130 0.014 0.140 0.20 3.05 0.25 3.30 0.36 3.56 0.255 0.250 0.245 6.48 6.35 6.22 9.53 7.62 7.37 7.87 0.300 0.290 0.310 2.29 2.54 2.79 0.090 0.100 0.110 b 11 e e 1 0.360 0.380 9.14 9.65 0 15 0.045 1.14 0.355 0.335 8.51 9.02 15 0 seating plane e a 2 a c e base plane 1 a 1 e l a s 1 e d 1 b b 8 5 1 4
ISD8101 ISD8101 datasheet rev. 1.8 - 19 - nov, 2012 8 ordering information ISD8101 x y i ISD8101 s y i r delivery form r: tape and reel package form; 2500 qty per reel package type x: die r: sop-8 s: sop-8 (with thermal ex-pad) p: pdip-8 lead-free y: lead - free temperature i: industrial -40 c to 85 c blank: commercial (die) 0 c to 50 c
ISD8101 ISD8101 datasheet rev. 1.8 - 20 - nov, 2012 9 revision history version date description 0.1 0.2 0.3 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 dec, 2009 dec. 20, 2009 jan. 15, 2010 mar. 10, 2010 mar. 16, 2010 jun. 07, 2010 jun. 28, 2010 dec 30, 2010 jan 31, 2011 jun 30, 2011 oct 20, 2011 nov 30, 2012 initial draft switched names on pin 1, 2 updated specs with values from initial testing updated with full test results modified to show preliminary status added ordering option information added instructions/equations for application schema tics added the simple application schematic modified the application schematics update the format update the ordering information added the sop8 with thermal ex pad package specific ation
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